Screen

Class-S

Class-B

Mil Method

Reqt.

Mil Method

Reqt.

 Wafer Lot Acceptance

5007

All lots

N/A

---

Non-destructive Bond Pull

2023

100%

N/A

---

 Internal Visual Inspection

2010, Test Condition A

100%

2010, Test Condition B

100%

Temperature Cycling

1010, Test Condition C

100%

1010, Test Condition C

100%

 Constant Acceleration

2001, Test Condition E

100%

2001, Test Condition E

100%

 Visual Inspection

for catastrophic failures

100%

for catastrophic failures

100%

 Particle Impact Noise Detection (PIND)

2020, Test Condition A

100%

N/A

---

 Serialization

---

100%

N/A

---

 Pre-Burn-in Electrical Parameters

per device specifications

100%

per device specifications

100%

 Burn-in

1015, 240H at 125C min.

100%

1015, 160H at 125C min.

100%

Interim Post-Burn-in Electrical Parameters

per device specifications

100%

N/A

---

 Reverse-bias Burn-in

1015, Test Cond. A or C; 72H/150C

100%

N/A

---

 Interim Post-Burn-in Electrical Parameters

per device specifications

100%

per device specifications

100%

 Percent Defective Allowable (PDA) Computation

5% over-all; 3% for functional pa-rameters at 25C

All lots

5%

All lots

Final Electrical Tests

a.  Static Tests

b.  Dynamic/Functional Tests

c.  Switching Tests

per device specifications

100%

per device specifications

100%

 Seal Tests

a. Fine Leak

b. Gross Leak

1014

100%

1014

100%

 Radiographic Test

2012, two views

100%

N/A

---

Qualification or QCI Test Sampling

5005

per Mil Method 5005

5005

per Mil Method 5005

 External Visual Inspection

2009

100% or 116(0) (see  notes in Mil Method 5004)

2009

100% or 116(0)

(see  notes in Mil Method 5004)

 Radiation Latch-up

1020

100%

1020

100%

Method No.

Name of Method

Purpose

Equipment Needed

1004

Moisture Resistance Test

To evaluate in an accelerated manner the resistance of component parts and constituents to the effects of high-humidity and heat conditions

Uses temperature/humidity chambers capable of cycling conditions

1005

Steady-State Life Test

To determine the reliability of devices subjected to specified conditions (standard: 125 deg C with steady-state bias) over an extended period of time (standard: 1000 hours minimum)

Uses a controlled temperature chamber/oven, power supplies, measuring devices

1006

Intermittent Life Test

To determine the reliability of devices subjected to specified conditions that involve cyclical "on-off" variations in electrical stresses

Same as Method 1005 but electrical excitation must be dynamic

1008

Stabilization Bake

To determine the effect of storage at elevated temperatures without electrical stress applied

Uses a controlled temperature chamber/oven

1009

Salt Atmosphere Test

To serve as an accelerated laboratory corrosion test simulating the effects of seacoast atmosphere

Uses a salt atmosphere chamber

1010

Temperature Cycling

To determine the resistance of a part to extremes of high and low temperatures

Uses a temp cycling chamber capable of providing and controlling  temperatures

1011

Thermal Shock

To determine the resistance of the part to sudden exposures to extreme changes in temperature and alternate exposures to these extremes

Uses thermal shock equipment capable of providing and controlling specified temperatures

1012

Thermal Characteristics Tests

To determine the thermal characteristics of devices: junction temperature, thermal resistance, case and mounting temperatures, thermal response time, etc.

Uses a controlled temperature chamber, thermocouples, electrical measurement equipment, IR microradiometer, etc.

1013

Dew Point Test

To detect the presence of moisture trapped inside a device package that may affect device parameters, i.e., leakage current

Uses an equipment that can expose the device to the specified high temp down to -65 deg C while measuring affected parameters

1014

Hermeticity Tests

To determine the hermeticity of the seal of devices with internal cavities

Uses a fine leak tester and a gross leak tester

1015

Burn-in Test

To eliminate units with marginal defects that can result in early life failures

Uses a burn-in oven capable of providing high temperature (100-250 deg C) and electrical stress

1016

Life/Reliability Characterization Tests

To determine life distributions, life acceleration characteristics, and failure rate potential of devices

Uses a burn-in oven capable of providing high temperature (200-300 deg C) and electrical stress

1018

Internal Water Vapor Content Test

To measure the water vapor content of the atmosphere inside a hermetically-sealed device

Uses a mass spectrometer or moisture sensor, vacuum chamber, and a piercing system